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Most read articles
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MOSFET
Nexperia’s first SiC MOSFETs raise the bar for power switching in industrial applications
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POWER TECHNOLOGY
LEM launches 800V HAH3DR current sensor for three phase automotive traction inverter power modules
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MOSFET
New 62mm package in Infineon’s CoolSiC™ portfolio offers higher efficiency and power density
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TRANSISTOR TECHNOLOGY
Toshiba launches 30V N-Channel common-drain MOSFET
Galleries
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MARCOM AWARDS
DigiKey honored with four MarCom Awards for branding refresh
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RENEWABLE ENERGY
"Renewable Energy Valleys" to accelerate the energy transition
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ENERGY TECHNOLOGY
Intel technology helps power solution for a more resilient grid
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ENERGY STORAGE
Northvolt develops state-of-the-art sodium-ion battery validated at 160 Wh/kg
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Do you characterize High Power Electronics SiC devices?
Learn how to do “Double Pulse Testing” with an Oscilloscope
Tektronix dives into the most common methodology for dynamic characterization of Wideband gap switching devices and discuss best practices and setup to determine accurately all switching parameters.
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Choosing a Suitable AC Source or DC Supply
Top Considerations For Modern AC and DC Power Supplies
Choosing the optimum programmable AC source or DC supply for your application extends well beyond choosing AC or DC and a voltage, current, and frequency rating.
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Laser welding in comparison with conventional soldering technology
Development of Cu-Cu Joining Technology by Laser Welding
There is a growing demand for more effective assembly technologies. This paper presents the results of laser welding, which connects the copper (Cu) terminal to the Direct Copper Bonded (DCB) substrate within the power semiconductor discrete package.
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Are You Involved with inverters, Motors, or Drive Analysis?
Learn how to Make Measurements on 3-Phase Motor Drives
Learn how to enable your Oscilloscope to carry out stable and accurate measurements on PWM waveforms.
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BASIC KNOWLEDGE - LASER DIODES
Laser diode: Definition, types, and more
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POWER TECHNOLOGY
Hitachi Energy launches liquid-filled transformers with Transient Voltage Protection Technology
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PART 4: SEMICONDUCTOR MANUFACTURING
Doping: The semiconductive character
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PART 3: SEMICONDUCTOR MANUFACTURING
Semiconductor circuit design: key chemical procedures
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Diotec Semiconductor AG
Light and Sight with LED Fog Lamp using the MMTL431AR-AQ
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CeramTec GmbH
Aluminium Nitride AlN Substrates
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Schunk Sonosystems GmbH
Wire Harness
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dSPACE GmbH
Smart Charging Solution
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ELECTROMOBILITY
NXP expands S32 platform with motor control solution for software-defined vehicle edge nodes
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ELECTRONIC DESIGN AUTOMATION
Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
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3D IC DESIGN
TSMC announces breakthrough set to redefine the future of 3D IC
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