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CHIP TECHNOLOGY AMD may have unveiled the future of processors

Editor: Florian Richert

AMD showcased the latest innovations across the high-performance computing ecosystem in late May. In her keynote at COMPUTEX 2021, AMD President and CEO Dr. Lisa Su showcased the latest AMD technologies developed in-house and collaborated with partners to power the game consoles, PCs, and data centers of the future.

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AMD's new 3D chiplet technology, developed in partnership with TSMC.
AMD's new 3D chiplet technology, developed in partnership with TSMC.
(Source: AMD)

At COMPUTEX 2021, AMD showcased its latest computing and graphics technology innovations to accelerate the high-performance computing ecosystem, spanning gaming, PCs, and the data center. AMD President and CEO Dr. Lisa Su unveiled the latest breakthrough in high-performance computing pioneered by AMD with new 3D chiplet technology; expanded adoption of AMD computing and graphics technologies in the automotive and mobile markets with industry leaders Tesla and Samsung; new AMD Ryzen™ processor offerings for enthusiasts and consumer PCs; leadership data center performance with the latest 3rd Gen AMD EPYC™ processors; and a full slate of new AMD graphics technologies for gamers.

“At Computex, we highlighted the growing adoption of our high-performance computing and graphics technologies as AMD continues setting the pace of innovation for the industry,” said Dr. Su. “With the launches of our new Ryzen and Radeon processors and the first wave of AMD Advantage notebooks, we continue expanding the ecosystem of leadership AMD products and technologies for gamers and enthusiasts. The next frontier of innovation in our industry is taking chip design into the third dimension. Our first application of 3D chiplet technology at Computex demonstrates our commitment to continue pushing the envelope in high-performance computing to enhance user experiences significantly. We are proud of the deep partnerships we have cultivated across the ecosystem to power the products and services that are essential to our daily lives.”

Accelerating Chiplet and Packaging Innovation

AMD continues to build on its leadership IP and investments in leading manufacturing and packaging technologies with AMD 3D chiplet technology, a packaging breakthrough that combines AMD’s innovative chiplet architecture with 3D stacking using an industry-leading hybrid bond approach that provides over 200 times the interconnect density of 2D chiplets and more than 15 times the density compared to existing 3D packaging solutions. Pioneered in close collaboration with TSMC, the industry-leading technology also consumes less energy1 than current 3D solutions and is the most flexible active-on-active silicon stacking technology in the world.

AMD showed the first application of 3D chiplet technology at COMPUTEX 2021 – a 3D vertical cache bonded to an AMD Ryzen™ 5000 Series processor prototype designed to deliver significant performance gains across a broad set of applications. AMD is on track to begin production on future high-end computing products with 3D chiplets by the end of this year.

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