Siemens Digital Industries Software has announced that Chipletz, a fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its Smart Substrate products.
After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens’ industry-leading EDA tools for the design and verification of its Smart Substrate technology, which facilitates the heterogeneous integration of multiple ICs in a single package for critical artificial intelligence workloads, immersive consumer experiences, and high-performance computing.
“The Chipletz vision is to revolutionize semiconductor in-package functionality through the development of advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance,” said Bryan Black, chief executive officer of Chipletz. “Our Smart Substrate designs, now in development, are very demanding. Siemens has demonstrated that they have the ideal technology for our needs.”
To design and verify the heterogeneous integration of multiple ICs into a Smart Substrate based package, Chipletz selected Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software and Calibre 3DSTACK software solutions.
“Siemens is honored to be selected by Chipletz as a primary semiconductor packaging design and verification supplier,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “The Chipletz Smart Substrate technology offers Chipletz customers a robust path to bring multiple ICs, even from different vendors, into a wide range of system-in-package configurations using Siemens’ design tools to deliver a high-performing and cost-effective end-product.”
Declaration of consent
Consent to the use of data for advertising purposes
I consent to the use of my email address to send editorial newsletters by Mesago Messe Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany including all of its affiliates within the meaning of Section 15 et seq. AktG (‘Mesago’). I have viewed lists of each group of affiliates here for the Mesago. The content of the newsletter covers the products and services of all of the companies listed above including, for example, trade magazines and specialist books, events and exhibitions and event-related products and services, printed and digital media products and services such as additional (editorial) newsletters, competitions, lead campaigns, online and offline market research, technical web portals and e-learning courses. If my personal telephone number has also been collected, it may be used to send offers for the aforementioned products and services from the above companies, as well as for market research purposes. If I wish to access protected content online on portals of Mesago including its affiliates within the meaning of Section 15 et seq. AktG, I must register with additional data in order to access that content. In return for this free access to editorial content, my data may be used in line with this declaration of consent for the purposes described herein.
Right to withdraw consent