:quality(80)/p7i.vogel.de/wcms/be/bc/bebc3a12d4449d78e15880778f06ddf7/0111650077.jpeg "The new skid-mounted ESS aims to lower the threshold for industrial and commercial users to transit to green energy with less effort, greater effectiveness, and in a timely manner. (Source: Delta Electronics, Inc.)")
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:quality(80)/p7i.vogel.de/wcms/cb/ba/cbba3544178144f3e16070db0ec4752c/0111288451.jpeg "Type DSM Supercapacitor Modules are available from select CDE-authorized distributors. (Source: StockGood - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/94/52/94526f146b3f1100758d4cf9fe485eff/0111863368.jpeg "South Korea's Samsung plans to catch up to and surpass the production capabilities of Taiwan's TSMC within the next five years. (Source: Flag Store - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/23/bd/23bdd23eb8a2cd35ef06611b16ae5e3d/0106006796.jpeg "The chip shortage is a global problem; a hugely messy situation that some analysts in the early days of the shortage predicted would be over and done with. Now, some say it might continue well into next year and beyond. (Source: kaptn - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/7b/fb/7bfb8b950ce58b66d799295d83cc1d85/0111516865.jpeg "The global chip shortage emerged in 2020 and is an ongoing problem where the demand for integrated circuits such as computer chips is greater than supply. (Source: Quardia Inc. - stock.adobe.com)")
CHIP SHORTAGE NEWS :quality(80)/p7i.vogel.de/wcms/41/2f/412f7d1f055b805c523b9cc2b95ec2e3/0109257261.jpeg "The global chip shortage emerged in 2020 and is an ongoing problem where the demand for integrated circuits such as computer chips is greater than supply. (Source: Quardia Inc. - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/2c/ca/2cca7bae0178040fc04966533a089030/0111957425.jpeg "The electric vehicale storage batteries are used to build a stable energy supply system and realizing a recycling-oriented society. (Source: UHDHDR - stock.adobe.com)")
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:quality(80)/p7i.vogel.de/wcms/ec/ce/ecce7eaf706c4c3edea8473c2702ef68/0110038598.jpeg "Indeed, governments are already taking an active role in mandating the security of energy systems through legislative and compliance efforts, diversifying energy technologies, and working with businesses to optimize industry resilience. (Source: Maksim Shmeljov - stock.adobe.com)")
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MATERIALS FOR POWER MODULE ASSEMBLY
How to increase high reliability operation for power devices
:quality(90)/p7i.vogel.de/wcms/61/9d/619d1a62cb3e2/wp-vorschaubild-showa-denko-wp-lg-pb-2021-12-01.png "WP-Vorschaubild_Showa_Denko_WP_LG_PB_2021-12-01")
This paper will give you an overview on materials to increase reliability through better heat dissipation, thermal management as well as insulation.
Increasing the operating temperature of power devices in automotive applications not only improves the power density but also simplifies the cooling systems. The development of compound semiconductors such as SiC, GaN, and GaO, which allow for higher operating temperatures over 200 °C, accelerates this trend. However packaging materials are not applicable to higher operating temperatures. In particular, die bonding material and insulation materials suffer from severe thermal strain. Therefore Showa Denko Materials has developed and is continuing the deployment of newly developed Cu paste material, High heat Polymide-Imide material as well as Epoxy molding compound.
With this product note you will understand:
- How to achieve a very high bondability and increase in power cycling capability with Cu paste
- How to achieve high adhesion inside your power semiconductor package using a PI-Imide coating
- How to achieve low warpage and low stress for your power device using a high Tg Epoxy molding compound
The provider of this whitepaper