Discover the PCIM Europe

SEMICONDUCTOR FACTORY New 300-millimeter semiconductor wafer fab in Utah

From Texas Instruments Incorporated (press release) Reading Time: 2 min |

Related Vendors

Texas Instruments Incorporated has announced plans to build its next 300-millimeter semiconductor wafer fabrication plant (or fab) in Lehi, Utah. It will be located next to the company’s existing 300-mm semiconductor wafer fab in Lehi, LFAB. Once completed, TI’s two Lehi fabs will operate as a single fab.

The historic USD 11 billion investment in manufacturing capacity further extends the company's cost advantage and provides greater control of supply.
The historic USD 11 billion investment in manufacturing capacity further extends the company's cost advantage and provides greater control of supply.
(Source: Texas Instruments Incorporated)

"This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come," said Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer. "Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity."

The landmark USD 11 billion investment marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800 additional TI jobs as well as thousands of indirect jobs. TI looks forward to strengthening its partnership with the Alpine School District and will invest USD 9 million to improve student opportunities and outcomes.

"Companies like Texas Instruments continue to invest in Utah because of our world-class business climate and exceptional workforce," said Utah Gov. Spencer Cox. "TI’s new semiconductor fab will solidify Utah as a global semiconductor manufacturing hub for generations to come."

Lehi is an ideal location because of its access to skilled talent, robust existing infrastructure and strong network of community partners. The new fab will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere.

The fab will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Plans include recycling water at nearly double the rate of the existing Lehi fab. Advanced 300-mm equipment and processes in Lehi will further reduce waste, water and energy consumption per chip.

Construction of the new fab is expected to begin in the second half of 2023, with production as early as 2026. The cost of the new fab is comprehended in TI’s previously announced capital spending plan to expand manufacturing capacity and will complement TI’s existing 300-mm fabs, which include DMOS6 (Dallas), RFAB1 and RFAB2 (both in Richardson, Texas), and LFAB (Lehi, Utah). TI is also building four new 300-mm wafer fabs in Sherman, Texas.

PCIM Europe 2023: Experience a world of power electronics

(Source: Mesago)

You would like to experience trends of the power electronics industry at first hand? Discover up to 500 exhibitors and their products, gain knowledge in over 400 top-class presentations at the conference and benefit from countless networking opportunities with the community at the largest PCIM Europe ever from 9 – 11 May 2023 in Nuremberg, Germany.

Get your ticket now

(ID:49214212)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy.

Unfold for details of your consent