Discover the PCIM Europe

COOLING New chip cooler for power semiconductors developed

Related Vendors

Especially when developing flat housings, engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics. Thought should be given to this issue already during the concept phase as it may prove difficult to solve this problem if there is very little space for dissipating heat. SEPA EUROPE has developed a smart solution for such requirements, namely the HZ210 – an in-house development that is available in different dimensions.

Developing engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics.
Developing engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics.
(Source: JoyImage - stock.adobe.com)

SEPA EUROPE has developed the new high performance active heat sink HZ210 using the powerful LY60B radial fan. The case study achieved an impressively low thermal resistance of 0.5K/W during laboratory testing. With an overall height of a mere 25 mm this opens up new possibilities for developers to enable the cooling of power components in flat housings.

In the event that a temperature increase of 40K is allowed, 80W power loss can be reliably dissipated. The cooling system comprising SEPA blower, extruded heat sink and cover plate keeps the noise at a comfortably low level. The microphone recorded no more than 34dB(A) in the anechoic chamber.

Power semiconductors can be cooled with the compact HZ210 active heat sink.
Power semiconductors can be cooled with the compact HZ210 active heat sink.
(Source: SEPA EUROPE GmbH)

The fan is available in 5V and 12V versions and has a service life of 210000 h (MTBF) at 40 °C thanks to its reliable MagFix sleeve bearing.

Follow us on LinkedIn

Have you enjoyed reading this article? Then follow us on LinkedIn and stay up-to-date with daily posts about the latest developments on the industry, products and applications, tools and software as well as research and development.

Follow us here!

(ID:48479606)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy.

Unfold for details of your consent