Rogers Corporation

About Rogers Corporation - Advanced Electronics Solutions

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Advanced Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and RF Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.

Rogers AES offers advanced material technologies to noticeably increase efficiency, regulate heat, and ensure the quality and reliability of power and optoelectronic devices. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic materials are used in applications for e-Mobility, automotive safety and radar systems, mobile devices, renewable energy, energy-efficient motor drives, industrial equipment, wireless infrastructure and more. curamik® ceramic substrates (DCB & AMB) made of ceramic and copper, as well as curamik microchannel coolers are manufactured In Eschenbach (Upper Palatinate) by Rogers Germany GmbH. ROLINX® Busbars (manufactured by Rogers BV in Gent, Belgium) are made of copper or aluminum layers separated by insulating materials and laminated into a single structure. For printed circuit board applications, Rogers manufactures high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements. For more information, visit www.rogerscorp.com.

Product Portfolio

curamik® Ceramic Substrates

curamik high temperature / high voltage substrates consist of pure copper, which are bonded to a ceramic substrate, such as Al2O3 (aluminum), AlN (aluminum nitride), HPS (ZrO2 doped) or Si3N4 based on silicon (silicon nitride). Rogers offers two technologies for attaching the substrate to the copper. DCB (Direct Copper Bonded) - a high-temperature melting and diffusion process in which the pure copper is bonded to the ceramic, and AMB (active metal brazing) - a high-temperature process in which the pure copper is soldered to the ceramic substrate.

Products:

•           curamik Endurance

•           curamik Power

•           curamik Power Plus

•           curamik Thermal

•           curamik Performance

curamik® Cooling Solutions

Rogers offers two types of cooling solutions: liquid coolers or passive cooling. For liquid cooling, Rogers offers curamik CoolPower and CoolPower Plus, as well as curamik CoolPerformance and CoolPerformance Plus. At the heart of these liquid coolers is a micro- or macrochannel structure made of thin copper foils that are joined together to form a hermetically sealed block using the curamik bonding process. The specific channel structure determines the thermal resistance, the pressure drop and the flow. The cooling water is usually supplied and discharged through openings that are connected with O-rings or screw connections. Liquid coolers are the optimal solution for high-performance applications. curamik CoolEasy is a high-precision copper cooler for the passive cooling of laser diodes.

Products:

•           curamik CoolPower

•           curamik CoolPower Plus

•           curamik CoolPerformance

•           curamik CoolPerformance Plus

•           curamik CoolEasy

ROLINX® Busbars

ROLINX busbars are constructed and manufactured laminated busbars that meet the strictest requirements for railway drive converters, network-, wind- and solar converters, as well as drives for industrial applications. They have a low inductance, controlled partial discharge, high current capacities and compactness.

Products:

•           ROLINX CapLink Solutions

•           ROLINX Compact

•           ROLINX Easy

•           ROLINX Flex

•           ROLINX Housing Solutions

•           ROLINX Hybrid

•           ROLINX Performance

•           ROLINX PowerCircuit Solutions

•           ROLINX Thermal

RF Solutions

RF Solutions are high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements. With exceptional dielectric constant control and low dielectric loss, these materials are a consistent and reliable choice for applications including 5G wireless communication, commercial radar sensors, aerospace, satellites and more.

 Products:

•           RADIX™ - 3D Printable Dielectric

•           MAGTREX® Laminates

•       RO3003G2™ Laminates

•           RO4830™ Laminates

•           RO4835™ Laminates

•           AD Series™ Laminates

•           CLTE-MW™ Laminates

•           COOLSPAN® Thermally and Electrically Conductive Adhesive

•           Kappa® 438 Laminates

•           RT/duroid® Laminates

•           SpeedWave™ 300P Prepreg

•           TC Series™ Laminates

•           92ML™ Laminates and Prepregs