Toshiba Electronic Devices & Storage Corporation has launched "TLP3475W," a photorelay in a small, thin WSON4 package. It reduces insertion loss and suppresses power attenuation in high-frequency signals and is suitable for the pin electronics of semiconductor testers, which use a large number of relays and require high-speed signaling.
The photorelay provides reduced insertion loss and improved high-frequency signal transmission characteristics.
Toshiba’s optimized package designs reduces parasitic capacitance and inductance in the new photorelay. This reduces insertion loss and improves the transmission characteristic of high-frequency signals to 20GHz (typ.), about 1.5 times lower than Toshiba’s current product, TLP3475S.
TLP3475W uses a small, thin WSON4 package that is only 0.8mm (typ.) thick, making it the smallest photorelay in the industry to realize improved high-frequency signal transmission characteristics. It is 40 % lower in height than Toshiba’s ultra-small S-VSON4T package, allowing more products to be mounted on the same circuit board, and will contribute to improved measuring efficiency.
Toshiba will continue to expand its product line-up to support semiconductor testers that deliver higher speeds and greater functionality.
Improving to pass the high-frequency signals: f=20GHz (typ.), Insertion loss(S21) = -3dB
Normally open function (1-Form-A)
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