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POWER MODULES Vicor to celebrate opening of the industry’s first “ChiP” fab

From Johanna Erbacher

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On May 18, state and local officials will celebrate the opening of a new, state‑of‑the‑art power module manufacturing facility. The world’s first ChiP (Converter housed in Package) fabrication facility, or “ChiP fab” enables scalable, automated, cost-effective manufacturing of power modules in the United States.

The new ChiP foundry will provide capacity to meet high-volume requirements of ChiP customers.
The new ChiP foundry will provide capacity to meet high-volume requirements of ChiP customers.
(Source: Vicor )

At 400 Federal Street, at 10:00am on May 18th, 2022, Vicor employees and senior management will be joined by state and local government representatives.

With its new ChiP foundry, Vicor takes a major step toward realizing its vision to enable high‑performance, modular power system solutions capable of satisfying demanding power requirements.

Vicor ChiPs are manufactured in panels utilizing process steps analogous to semiconductor wafer fabs.
Vicor ChiPs are manufactured in panels utilizing process steps analogous to semiconductor wafer fabs.
(Source: Vicor )

“Our new ChiP fab integrates all of the process steps necessary to manufacture high‑density power modules in wafer-like panels with short cycle time and flexible capacity,” said Mike McNamara, Vicor Vice President of Operations.

The new facility comes online as Vicor celebrates 41 years of expanding its performance leadership within the global power electronics industry with U.S.-based manufacturing.

The new, vertically-integrated ChiP fab utilizes patented fabrication processes that further differentiate Vicor power modules by enabling the most power-dense and energy efficient solutions.

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